Specialized process services tailored to meet your semiconductor manufacturing needs

Comprehensive trials for all standard wafer sizes, including smaller samples or coupons, to optimize your processes.

Precision thinning and grinding services for thinning and device wafers to meet exact specifications.

Independent lab-based testing and optimization of consumables to enhance process efficiency.

Innovative solutions for developing processes on cutting-edge materials and efficiencies on standard materials.

Advanced analysis, including Particle Size Distribution (PSD), to ensure slurry performance and quality.